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Mecanisme de defectare ale componentelor

Pret: 66.00 RON
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Titu-Marius Bajenescu, Marius Bazu

Mecanisme de defectare ale componentelor electronice

Editura: Matrixrom

Cuvânt înainte Prefaţă Introducere 1. Cum se defectează componentele electronice 2. Despre fiabilitatea componentelor electronice 3. Moduri şi mecanisme de defectare ale componentelor electronice pasive 4. Moduri şi mecanisme comune de defectare, induse de procesul de fabricaţie 5. Moduri şi mecanisme de defectare ale tehnologiei bipolare cu siliciu 6. Moduri şi mecanisme de defectare ale tehnologiei MOS cu siliciu 7. Moduri şi mecanisme de defectare specifice tehnologiilor opto-electronice şi fotonice 8. Moduri şi mecanisme de defectare specifice tehnologiilor pe alte materiale semiconductoare decât siliciul 9. Moduri şi mecanisme de defectare specifice tehnologiei circuitelor integrate hibride 10. Moduri şi mecanisme de defectare specifice tehnologiilor pentru realizarea de micro- şi nanosisteme ANEXE

  

Failure Analysis: A Practical Guide for

Pret: 929.00 RON
Disponibil in 14 zile!

Marius Bazu (Author)

Failure Analysis: A Practical Guide for Manufacturers of Electronic Components and Systems

Editura: JOHN WILEY & SONS INC

Anul aparitiei: 2011

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital ...

  
 
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